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Advanced Logic technology

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The development of logic technology has led to 3D integration and BEOL technology development. In our lab we work on BEOL material development, collaborating with Dr. Kim Hyungjun of PSI. We develop new material for BEOL interconnect, channel materials and so on.

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  • Reseach topics for Advanced Logic technology

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1. Novel interconnect materials​​

- Topological metal development (MBE); in collaboration with Dr. Kim, Hyungjun

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2. New channel material for BEOL

- 2D material for semiconductor channels (TMDC, MXene etc.); in collaboration with KIMS and Dr. Seon Joon Kim (KIST)

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